Thermal release film
A non-silicone film product that leaves no residue after peeling, even when heat-treated!
The "Thermal Release Film" is a film product mainly used for handling and transporting Si wafers. Therefore, it has high heat resistance and excellent performance against plasma treatment. Being non-silicone based, it leaves no residue after peeling, even after heat treatment. (No residue is observed under SEM (magnification of 25 to 2,000 times).) Additionally, we also offer a "Temporary Fixing Film for Embedded Components" that can be used for temporarily fixing chips and capacitors when embedding them in substrates. 【Features】 ■ Mainly used for handling and transporting Si wafers ■ High heat resistance and excellent performance against plasma treatment ■ No peeling residue *For more details, please refer to the PDF document or feel free to contact us.
- Company：AJ(エージェイ）
- Price：Other
